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                                PCB流程一
                                2014-12-24 14:08:54


                                 依工單上所指示之發料數和尺寸圖,將基板裁切成所需之工作尺寸
                                Cut according to the quantity and size of working panel listed on the travel card


                                修飾裁切后之基板板邊,使之平滑,減少板面間及后續制程對涂布輪、底片之刮傷
                                Edge grind to ensure smooth and reduce scratch by coating tracks and films.

                                 

                                利用藥水及磨刷輪與PCB板銅面進行化學/物理反應,達到清潔/粗化銅面目的。
                                Chemical reactions between brush track and surface of PCB by chemicals to keep clean and coarson the surface.

                                 

                                利用滾輪涂布方式在PC板雙面垂直覆蓋一層感光油墨  Put LPRI on the surface of PCB in vertical direction by track coating.


                                 利用紫外線(UV)的能量﹐透過底片照射在板面的感光油墨上﹐使油墨中的光敏物質發生光聚合反應﹐完成影像轉移的目的
                                The PCB with LPRI expose in UV light which penetrates through films to transfer image from film to PCB  by photopolymerization.

                                將未受光區域及其膜下之銅層分別用顯影液及蝕刻液去除,最后再用去膜液將感光抗蝕層剝除,形成之內層線路圖像.
                                Remove the copper in unexposure area and under film by developing solution and etching solution. And then strip the photosensitive corrosion resistant layer by solution to pattern in inner layer.
                                 


                                 利用CCD鏡頭抓取投射在板面上”反射光圖像”原理﹐對蝕刻后的板面進行掃描﹐并與CAM圖像對比﹐進行斷路﹑短路﹑殘銅﹑缺口等不良點的判讀 Implement AOI inspection comparing with CAM data by CCD to avoid open/short/coppper residue/nick defect and so on.

                                利用CCD抓取靶標中心,配合Spindle對靶標進行中心貫穿作業。Get the target centre by CCD and run through the PCB by spindle.
                                 

                                 
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