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                                2014-12-24 13:52:27

                                Coarsen the surface by micro-etching and form copper oxide on the surface by brown solution,add the adhension between conductor and resin.

                                Multilayers after combination should be lay up with copper foil and PP.

                                Multilayers after lay up should be bonded by high temperature and pressure.

                                將壓合好之冊板與 lay up 相反程序拆出分開疊放.
                                Use the mark line to unload the finished laminition boards which is just oppsite with the lay up procedure and separate them one by one.

                                通過X-RAY /CCD對位系統抓取內層靶標,再利用高速運轉的主軸配合鉆頭將其定位孔鉆出
                                Get the target in inner layer by X-ray/CCD and drill location hole by drill bits and spindle with high speed.

                                Performing LM routing cut the useless flowed resin on the boards edge.



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